Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

ASE Technology Holding Co. is experiencing renewed growth, driven by surging demand for advanced semiconductor packaging and TSMC outsourcing CoWoS orders. ASX stock has returned 52.4% over the past ...

The smart use of technology can improve your packaging, helping to give you an edge in the competitive market. By using modern technology rather than only using traditional packaging methods, you can ...

SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging sector. A ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).